Coupled Microstructural and Calorimetric Investigation of Controlled Solder Joint Microstructures in Pb-Free Solder
نویسندگان
چکیده
منابع مشابه
Lead-free Solder Joint Quality Investigation
New Pb-free materials ask thorough verification because their properties as wetting, solderability and mechanical properties are different from these SnPb. In this paper are presented some new facts from creep and stress relaxation investigation including new arrangement for measurement. Results from creep, stress, shear and bend testing are presented for three types of solder (Sn/3.5Ag, Sn/3.8...
متن کاملFRAGILITY OF Pb-FREE SOLDER JOINTS
Recent investigations have revealed that Pb-free solder joints may be fragile, prone to premature interfacial failure particularly under shock loading, as initially formed or tend to become so under moderate thermal aging. Depending on the solder pad surface finish, different mechanisms are clearly involved, but none of the commonly used surface finishes appear to be consistently immune to embr...
متن کاملFragility of Pb-free Solder Joints
Recent investigations have revealed that Pb-free solder joints may be fragile, prone to premature interfacial failure particularly under shock loading, as initially formed or tend to become so under moderate thermal aging. Depending on the solder pad surface finish, different mechanisms are clearly involved, but none of the commonly used surface finishes appear to be consistently immune to embr...
متن کاملInvestigation of the Lead-free Solder Joint Shear Performance
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The purpose of this study is to investigate the effects of reflow profile and thermal shock on the shear performance of eutectic SnPb (SnPb) and Sn3.0Ag0.5Cu (SAC305) solder joints. Test boards were assembled with four different sized surface mount chip resisto...
متن کاملCreep Behavior of a Sn-Ag-Bi Pb-Free Solder
Compression creep tests were performed on the ternary 91.84Sn-3.33Ag-4.83Bi (wt.%, abbreviated Sn-Ag-Bi) Pb-free alloy. The test temperatures were: −25 °C, 25 °C, 75 °C, 125 °C, and 160 °C (± 0.5 °C). Four loads were used at the two lowest temperatures and five at the higher temperatures. The specimens were tested in the as-fabricated condition or after having been subjected to one of two air a...
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ژورنال
عنوان ژورنال: Microscopy and Microanalysis
سال: 2011
ISSN: 1431-9276,1435-8115
DOI: 10.1017/s1431927611010117